Earlier on last week, Prof. Inġ. Owen Casha and Dr Inġ. Russell Farrugia, from the Department of Microelectronics and Nanoelectronics, organised and hosted the 25th edition of the Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS (DTIP 2023) at the UM Campus in Valleta in collaboration with Prof. Emile Martincic, University Paris-Saclay and Prof. Pascal Nouet, University of Montpellier. This unique event presented the latest research in Design, Test, Integration and Packaging of Sensors, Actuators, Microsystems, MEMS, NEMS and MOEMS. Aspects including design, modeling, testing, micro-machining, integration and packaging of structures, devices and systems were an integral part of this symposium. The main sponsors were Plasma-Therm and Nextron. Special thanks go to Ms Lucienne May Bugeja, Ms Sarah Sammut and Ms Veronica Barbara (Conferences and Events Unit) and their colleagues for the sterling service provided during the organisation and hosting of this event.
The symposium was well attended and featured 35 accepted papers and 48 attendees from various countries including Italy, Japan, Tunisia, Libya, France, Spain, Canada, UAE, Portugal, Germany, Switzerland and Malta. The conference consisted of a number of presentation and poster sessions on various topics related to MEMS and MOEMS. A keynote presentation was delivered by Inġ. Roseanne Duca from STMicroelectronics, Malta titled “From Theory to Reality: Package Modeling in a Smarter World”. The symposium included also a social event which featured a guided walking tour in Birgu and a dinner. In particular, crossing to the Three Cities from Valletta by ferry was the perfect way for the participants to appreciate the fortifications of the Grand Harbour. The symposium was concluded on Wednesday 31 May 2023 with a visit to the STMicroelectronics facility in Kirkop where attendees could closely watch the work carried out on the MEMS front-end line, the MEMS back-end line and the MEMS testing line.
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